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Self-Assembled Si Quantum-Ring Structures on a Si Substrate by Plasma-Enhanced Chemical Vapor Deposition Based on a Growth-Etching Competition Mechanism

机译:基于生长腐蚀竞争机制的等离子增强化学气相沉积法在硅衬底上自组装硅量子环结构

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摘要

We have, for the first time, fabricated self-assembled Si quantum-ring structures on a Si substrate by using a PECVD technique based on a plasma growth/etching competi- tion mechanism. We obtained perfect Si quantum rings with excellent rotational symmetry and a narrow edge width (down to 10 nm). Moreover, the ring size and morphology were tuned by simply adjusting the timing procedure, and the fabrication process was fully compatible with standard microelectronic Si technologies. The as-grown Si ring structures could be electrically well isolated by controlling the ring/substrate junction bias condition, which lays the ground work for further device applications. We also suggest that this growth model, because it is not limited to certain specific material systems, actually represents a general scheme for controlling and tailoring the shapes, sizes, and complexities of self-assembled nanostructures.
机译:我们首次使用基于等离子生长/蚀刻竞争机制的PECVD技术在Si基板上制造了自组装Si量子环结构。我们获得了具有出色的旋转对称性和窄的边缘宽度(低至10 nm)的完美Si量子环。此外,只需调整时序程序即可调整环的尺寸和形态,并且制造工艺与标准微电子硅技术完全兼容。通过控制环/衬底的结偏置条件,可以很好地隔离生长的Si环结构,这为进一步的器件应用奠定了基础。我们还建议,这种增长模型,因为它不仅限于某些特定的材料系统,实际上代表了一种控制和定制自组装纳米结构的形状,尺寸和复杂性的通用方案。

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