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Low defect large area semi-polar (11... formula ...2) GaN grown on patterned (113) silicon

机译:在图案化(113)硅上生长的低缺陷大面积半极性(11 ...公式... 2)GaN

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摘要

We report on the growth of semi-polar GaN (112) templates on patterned Si (113) substrates. Trenches were etched in Si (113) using KOH to expose Si {111} sidewalls. Subsequently an AlN layer to prevent meltback etching, an AlGaN layer for stress management, and finally two GaN layers were deposited. Total thicknesses up to 5 m were realised without cracks in the layer. Transmission electron microscopy showed that most dislocations propagate along [0001] direction and hence can be covered by overgrowth from the next trench. The defect densities were below and stacking fault densities less than 100 cm . These numbers are similar to reports on patterned r-plane sapphire. Typical X-ray full width at half maximum (FHWM) were 500” for the asymmetric (00.6) and 450” for the (11.2) reflection. These FHWMs were 50 % broader than reported for patterned r-plane sapphire which is attributed to different defect structures and total thicknesses. The surface roughness shows strong variation on templates. For the final surface roughness the roughness of the sidewalls of the GaN ridges at the time of coalescence are critical.
机译:我们报告在图案化的硅(113)衬底上的半极性GaN(112)模板的增长。使用KOH在Si(113)中蚀刻沟槽,以暴露Si {111}侧壁。随后,为了防止回熔蚀刻而形成AlN层,用于应力管理的AlGaN层,最后沉积了两个GaN层。总厚度达到5 m,层中无裂纹。透射电子显微镜显示大多数位错沿着[0001]方向传播,因此可以被下一个沟槽的过度生长所覆盖。缺陷密度低于和堆积缺陷密度小于100厘米。这些数字类似于关于图案化r面蓝宝石的报道。不对称(00.6)的典型X射线半峰全宽(FHWM)为500“,(11.2)反射为450”。这些FHWM比报道的图案化r面蓝宝石宽50%,这归因于不同的缺陷结构和总厚度。表面粗糙度在模板上显示出很大的变化。对于最终表面粗糙度,聚结时GaN脊侧壁的粗糙度至关重要。

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