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Near-surface processing on AlGaN/GaN heterostructures: a nanoscale electrical and structural characterization

机译:AlGaN / GaN异质结构上的近表面处理:纳米级电学和结构表征

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摘要

The effects of near-surface processing on the properties of AlGaN/GaN heterostructures were studied, combining conventional electrical characterization on high-electron mobility transistors (HEMTs), with advanced characterization techniques with nanometer scale resolution, i.e., transmission electron microscopy, atomic force microscopy (AFM) and conductive atomic force microscopy (C-AFM). In particular, a CHF3-based plasma process in the gate region resulted in a shift of the threshold voltage in HEMT devices towards less negative values. Two-dimensional current maps acquired by C-AFM on the sample surface allowed us to monitor the local electrical modifications induced by the plasma fluorine incorporated in the material.The results are compared with a recently introduced gate control processing: the local rapid thermal oxidation process of the AlGaN layer. By this process, a controlled thin oxide layer on surface of AlGaN can be reliably introduced while the resistance of the layer below increase locally.
机译:研究了近表面处理对AlGaN / GaN异质结构性能的影响,结合了高电子迁移率晶体管(HEMT)上的常规电学表征和具有纳米级分辨率的先进表征技术,即透射电子显微镜,原子力显微镜(AFM)和导电原子力显微镜(C-AFM)。尤其是,在栅极区域中基于CHF3的等离子体工艺导致HEMT器件中的阈值电压向较小的负值偏移。通过C-AFM在样品表面上获得的二维电流图,我们可以监视由材料中掺入的等离子体氟引起的局部电变化,并将结果与​​最近引入的栅极控制处理进行了比较:局部快速热氧化工艺AlGaN层的厚度。通过该工艺,可以可靠地在AlGaN表面上引入受控的薄氧化物层,同时下面的层的电阻局部增加。

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