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Activation of sputter-processed indium–gallium–zinc oxide films by simultaneous ultraviolet and thermal treatments

机译:同时进行紫外线和热处理活化溅射处理的铟镓锌氧化物薄膜

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摘要

Indium–gallium–zinc oxide (IGZO) films, deposited by sputtering at room temperature, still require activation to achieve satisfactory semiconductor characteristics. Thermal treatment is typically carried out at temperatures above 300 °C. Here, we propose activating sputter- processed IGZO films using simultaneous ultraviolet and thermal (SUT) treatments to decrease the required temperature and enhance their electrical characteristics and stability. SUT treatment effectively decreased the amount of carbon residues and the number of defect sites related to oxygen vacancies and increased the number of metal oxide (M–O) bonds through the decomposition-rearrangement of M–O bonds and oxygen radicals. Activation of IGZO TFTs using the SUT treatment reduced the processing temperature to 150 °C and improved various electrical performance metrics including mobility, on-off ratio, and threshold voltage shift (positive bias stress for 10,000 s) from 3.23 to 15.81 cm2/Vs, 3.96 × 107 to 1.03 × 108, and 11.2 to 7.2 V, respectively.
机译:在室温下通过溅射沉积的铟镓锌氧化物(IGZO)膜仍需要活化才能获得令人满意的半导体特性。热处理通常在高于300°C的温度下进行。在这里,我们建议使用同时进行的紫外线和热(SUT)处理来激活溅射处理的IGZO膜,以降低所需的温度并增强其电特性和稳定性。 SUT处理有效地减少了碳残基的数量和与氧空位有关的缺陷部位的数量,并通过M-O键和氧自由基的分解重排增加了金属氧化物(M-O)键的数量。使用SUT处理激活IGZO TFT可以将处理温度降低到150 C,并改善了各种电气性能指标,包括迁移率,开/关比和阈值电压偏移(正偏置应力10,000 s)从3.23到15.81 cm 2 /Vs、3.96×10 7 至1.03×10 8 和11.2至7.2V。

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