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Effect of device design on charge offset drift in Si/SiO2 single electron devices

机译:器件设计对Si / SiO2单电子器件中电荷偏移漂移的影响

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摘要

We have measured the low-frequency time instability known as charge offset drift of Si/SiO2 single electron devices (SEDs) with and without an overall poly-Si top gate. We find that SEDs with a poly-Si top gate have significantly less charge offset drift, exhibiting fewer isolated jumps and a factor of two reduction in fluctuations about a stable mean value. The observed reduction can be accounted for by the electrostatic reduction in the mutual capacitance Cm between defects and the quantum dot, and increase in the total defect capacitance Cd due to the top gate. These results depart from the prominent interpretation that the level of charge offset drift in SEDs is determined by the intrinsic material properties, forcing consideration of the device design as well. We expect these results to be of importance in developing SEDs for applications from quantum information to metrology or wherever charge noise or integrability of devices is a challenge.
机译:我们测量了带有或不带有整体多晶硅顶栅的Si / SiO2单电子器件(SED)的低频时间不稳定性,即电荷偏移漂移。我们发现具有多晶硅顶栅的SED具有明显更少的电荷偏移漂移,表现出更少的隔离跃迁,并且在稳定平均值附近波动减少了两倍。所观察到的减少可以通过缺陷和量子点之间的互电容Cm的静电减少以及由于顶栅而导致的总缺陷电容Cd的增加来解决。这些结果偏离了著名的解释,即SED中电荷偏移漂移的水平由固有的材料特性决定,因此也必须考虑器件设计。我们希望这些结果对于开发从量子信息到计量学或在任何挑战充电噪声或器件可集成性的应用中开发SED具有重要意义。

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