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Research and Analysis of MEMS Switches in Different Frequency Bands

机译:不同频段MEMS开关的研究与分析

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摘要

Due to their high isolation, low insertion loss, high linearity, and low power consumption, microelectromechanical systems (MEMS) switches have drawn much attention from researchers in recent years. In this paper, we introduce the research status of MEMS switches in different bands and several reliability issues, such as dielectric charging, contact failure, and temperature instability. In this paper, some of the following methods to improve the performance of MEMS switches in high frequency are summarized: (1) utilizing combinations of several switches in series; (2) covering a float metal layer on the dielectric layer; (3) using dielectric layer materials with high dielectric constants and conductor materials with low resistance; (4) developing MEMS switches using T-match and π-match; (5) designing MEMS switches based on bipolar complementary metal–oxide–semiconductor (BiCMOS) technology and reconfigurable MEMS’ surfaces; (6) employing thermal compensation structures, circularly symmetric structures, thermal buckle-beam actuators, molybdenum membrane, and thin-film packaging; (7) selecting Ultra-NanoCrystalline diamond or aluminum nitride dielectric materials and applying a bipolar driving voltage, stoppers, and a double-dielectric-layer structure; and (8) adopting gold alloying with carbon nanotubes (CNTs), hermetic and reliable packaging, and mN-level contact.
机译:由于其高隔离度,低插入损耗,高线性度和低功耗,近年来,微机电系统(MEMS)开关引起了研究人员的广泛关注。在本文中,我们介绍了不同频段的MEMS开关的研究现状以及一些可靠性问题,例如电介质充电,接触故障和温度不稳定性。本文总结了以下几种提高MEMS开关高频性能的方法:(1)利用多个串联开关的组合; (2)在电介质层上覆盖浮法金属层; (3)使用介电常数高的介电层材料和低电阻的导体材料; (4)利用T匹配和π匹配开发MEMS开关; (5)设计基于双极性互补金属氧化物半导体(BiCMOS)技术和可重构MEMS表面的MEMS开关; (6)采用热补偿结构,圆形对称结构,热弯梁致动器,钼膜和薄膜包装; (7)选择Ultra-NanoCrystalline金刚石或氮化铝介电材料,并施加双极驱动电压,阻挡层和双介电层结构; (8)采用与碳纳米管(CNT)的金合金化,密封可靠的封装以及mN级接触。

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