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Synthesis and characterization of novel polyimides derived from 44’-bis(5-amino-2-pyridinoxy)benzophenone: effect of pyridine and ketone units in the main

机译:44’-双(5-氨基-2-吡啶氧基)二苯甲酮衍生的新型聚酰亚胺的合成和表征:主要部分中吡啶和酮单元的作用

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摘要

A diamine monomer, 4,4’-bis(5-amino-2-pyridinoxy)benzophenone, was designed and synthesized, and used to react with commercially different kinds of aromatic dianhydrides to prepare a series of polyimides containing pyridine and ketone units via the classical two-step procedure. Glass transition temperatures (T g) of the resultant polyimides PI-(1–5) derived from 4,4’-bis(5-amino-2-pyridinoxy) benzophenone with various dianhydrides ranged from 201 to 310 °C measured by differential scanning calorimetry. The temperatures for 5%wt loss of the resultant polyimides in nitrogen atmosphere obtained from the thermogravimetric analysis curves fell in the range of 472–501 °C. The temperatures for 10%wt loss of the resultant polyimides in nitrogen atmosphere fell in the range of 491–537 °C. Meanwhile, the char yields at 800 °C were in the range of 55.3–60.8%. Moreover, the moisture absorption of polyimide films was measured in the range of 0.37–2.09%. The thin films showed outstanding mechanical properties with tensile strengths of 103–145 MPa, an elongation at break of 12.9–15.2%, and a tensile modulus of 1.20–1.88 Gpa, respectively. The coefficients of thermal expansion of the resultant polyimides were obtained among 26–62 ppm °C−1. To sum up, this series of polyimides had a good combination of properties applied for high-performance materials and showed promising potential applications in the fields of optoelectronic devices.
机译:设计并合成了一种二胺单体4,4'-双(5-氨基-2-吡啶氧基)二苯甲酮,并用于与商业上不同种类的芳族二酐反应,以制备一系列含有吡啶和酮单元的聚酰亚胺。经典的两步过程。通过差示扫描法测得的由4,4'-双(5-氨基-2-吡啶氧基)二苯甲酮与各种二酐衍生得到的聚酰亚胺PI-(1-5)的玻璃化转变温度(T g)为201至310°C量热法。根据热重分析曲线获得的氮气氛中所得聚酰亚胺损失5%wt的温度在472-501°C范围内。氮气氛中所得聚酰亚胺损失10%wt的温度范围为491–537°C。同时,在800°C下的焦炭收率在55.3-60.8%之间。此外,测得的聚酰亚胺薄膜的吸湿率为0.37–2.09%。薄膜具有出色的机械性能,拉伸强度为103-145 MPa,断裂伸长率为12.9-15.2%,拉伸模量为1.20-1.88 Gpa。得到的聚酰亚胺的热膨胀系数在26–62 ppm°C -1 之间。综上所述,该系列聚酰亚胺具有适用于高性能材料的性能的良好组合,并在光电子器件领域显示出有希望的潜在应用。

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