基于微流体芯片结构的PDMS二次倒模工艺研究

摘要

研究了用于制作微流体芯片结构的聚二甲基硅氧烷(PDMS)与PDMS之间的倒模方法.首先,通过使用同一个微流体芯片模具倒出多个相同的PDMS负模结构；接着分别在各负模结构上溅射不同种类、不同厚度的金属,然后再对溅射过金属的负模上浇铸PDMS并固化以进行二次倒模,最后对二次倒模出的PDMS微流体结构表面粘连、结构完整性、尺寸等进行观测,从而通过比较得到倒模溅射所需的最佳金属和溅射金属薄膜的最优厚度.此方法倒出的PDMS微流体结构完整性好,不仅提出了一种全新的用于PDMS倒模的方法,而且解决了PDMS与PDMS之间直接倒模时所遇到的相互粘连和结构撕裂等难题.%The molding methods for polydimethylsiloxane( PDMS)and mold of PDMS based on microfulidic chip structure are investigated. Firstly, mold several same PDMS negative mold structures by using the same microfluidic chip. Then,sputter different thickness and types of metals on the PDMS negative mold structures,and then mold on it. Finally the structure of the secondary mold surface adhesion, structural integrity and size are investigated to determine the optimal metal and thickness. The PDMS microfluidic structural integrity is good by means of this method. This is not only a new method for PDMS molding,but also a novel solution to the mutual adhesion between PDMS and the PDMS mold and structural tear while molding directly and provides a good reference for which can not mold to get the structure of complex microfluidic chips.