双靶磁控溅射沉积Cu-W薄膜组织结构特征及其演变

摘要

Immiscible Cu-W alloy thin films were prepared using dual-target magnetron sputtering deposition process.The structure evolution of Cu-W thin films during preparation was investigated by X-ray diffraction,transmission electron microscopy and high resolution transmission electron microscopy.In the initial stage of dual-target magnetron sputtering deposition process,an amorphous phase formed; then it crystallized and the analogy spinodal structure formed due to the bombardment of the sputtered particles during sputtering deposition process,the surface structure of the film without the bombardment of the sputtered particles was the amorphous one,the distribution of the crystalline and amorphous phase showed layer structure.The solid solubility with the analogy spinodal structure was calculated using the Vegard law.For Cu-13.7％W (mole fraction) film,its structure was composed of Cu-11％W solution,Cu-37％W solution and pure Cu; for Cu-14.3％W film,it was composed of Cu-15％W solution,Cu-38％W solution,and pure Cu; for Cu-18.1％W film,it was composed of Cu-19％W solution,Cu-36％ W solution and pure Cu.%采用双靶磁控溅射沉积Cu-W合金薄膜,通过XRD、TEM和HRTEM等方法分析沉积薄膜组织结构及其演变规律.在沉积初期,Cu-W薄膜呈非晶态,随着沉积过程的进行,在溅射粒子的轰击下已沉积薄膜逐渐晶化并形成类调幅结构,从而在沉积完成的微米级Cu-W薄膜中呈现表层为非晶态、底层为晶态的层状结构.采用Vegard规则对类调幅结构的固溶度进行计算,Cu-13.7％W薄膜是由固溶度分别为11％W和37％W的Cu(W)固溶体及纯Cu相组成；Cu-14.3％W薄膜是由固溶度分别为15％W和38％W的Cu(W)固溶体及纯Cu相组成；Cu-18％W薄膜是由固溶度分别为19％W和36％W的Cu(W)固溶体及纯Cu相组成.