塑封微电路老炼研究综述

摘要

This paper reviews the application of plastic encapsulated devices in fields requiting high reliability, and the bum-in tests to check its reliability, with emphasis on the impacts of the increase of leakage currents and parameter variations accompanied with the improvement of integration extent and processing technology, which would become crucial where stressed voltage and temperatures are applied. Therefore, it is very important to carry out thermal stability study in the burn-in tests of plastic encapsulated device in order to achieve high reliability.%文章介绍了塑封微电路在高可靠性领域的应用,塑封微电路可靠性研究的现状,以及塑封微电路老炼研究在塑封微电路可靠性研究中的地位.具体分析了商用塑封器件老炼当前所面临的主要问题,其中重点介绍了随着器件集成度和工艺水平的提高,元器件漏电流的增加和元器件参数差异增大是老炼研究中不可忽略的因素.针对上述问题,指出了塑封微电路老炼过程热稳定研究的迫切性,尤其对我国高可靠应用领域,并介绍了国内外相关研究现状和我国在这一领域的差距.