首页> 中文期刊> 《科技创新导报》 >超高频、大功率化合物半导体器件与集成技术基础研究立项报告

超高频、大功率化合物半导体器件与集成技术基础研究立项报告

         

摘要

This project aims at the major demand of Chinese information processing and national security, and give full play to the compound semiconductor ultra high frequency, large power advantages, combined with the research of the "973" project, through the deep research on the regulation of the compound semiconductor materials with atomic level and growth kinetics, nano scale carrier transport mechanism and behavior the mechanism of signal transmission, and the coupling mechanism of UHF integrated technology in general science problem, the new material system and function structure, a new integrated technology and model simulation research work organically, multi-level, comprehensive solutions to the key scientific and technical bottleneck, form a comprehensive solution from scientific research and technological innovation have a group of independent intellectual property rights, and frontier achievements, development of UHF, high-power compound semiconductor devices, circuit and module, also made an international level of innovation team, construction of ultra high frequency, integrated application platform for high power semiconductor electronic devices, the establishment of digital transceiver demo system of millimeter wave, the transmission power is greater than 30W the realization of China, to the application of integrated technology breakthrough from the device research, from Ji Hz to sustainable development and innovation of terahertz microelectronic devices and integrated circuits across.%该研究针对我国信息处理和国家安全的重大需求,充分发挥化合物半导体超高频、大功率方面的优势,并结合前期“973”项目的研究基础,通过对化合物半导体材料原子级调控和生长动力学、纳米尺度下载流子输运机理与行为规律、超高频集成技术中信号传输机理与耦合机制等共性科学问题的深入研究,将新材料体系和新的功能结构、集成技术及模型模拟等方面研究工作有机结合,多层次、综合性地解决关键科学问题和技术瓶颈,从科学研究到技术创新形成综合解决方案,取得一批自主知识产权和前沿性成果,研制出超高频、大功率化合物半导体器件、电路和模块,同时造就一支具有国际水平的创新团队,构建超高频、大功率化合物半导体电子器件集成应用平台,建立毫米波、发射功率大于30 W的数字收发演示系统,实现我国从器件研究到集成技术应用的突破,从吉赫兹到太赫兹微电子器件和集成电路的可持续发展和创新跨越。

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