提高和改善'无铅化'多层板层间的结合力

摘要

The article describes that the bond between copper and resin in lead-free soldering.The traditional method of the roughness is challenged,the developmential direction is that the chemical bonding.%文章概述了无铅化多层板的层间结合力问题.依靠传统的粗糙度方法已经受到了挑战,而采用化学结合力应是发展的方向.