无铅技术的发展和未来

摘要

This paper describes the development and future of Pb-free. Technology including reflow process, reflow production system, temperature profile, mount companent and solder paste etc.%概述了包括再流焊工艺、再流焊生产系统、温度分布、搭载元件和焊膏等无铅技术的发展和将来.