PCB孔壁分离的影响因素分析及改善措施

摘要

Hole wall pull away is a reliability defect that appeared in the process of heat treatment of PCB and PCBA, and with the advancement of lead-free, the frequency of appearance increases. The defect has many impact factors. This article shows the impact factors analysis and improvements from the PCB design, PCB processing and PCB materials.%孔壁分离是PCB及PCBA热处理过程中出现的一种缺陷，而且随着无铅化的到来，出现的频率越来越高。孔壁分离的影响因素较多，从PCB设计、PCB加工、PCB原材料性能等多个方面进行影响分析，并提出相应的改善措施。