系统HDI金属化阶梯板的研究和开发

摘要

在对系统HDI、混压阶梯板、控深铣、激光钻孔等PCB制作技术重点分析的基础上，设计了新的制作流程，实现了系统HDI板与金属化阶梯制作的集成，从而开发出了可应用于焊接各类功能模块的系统HDI金属化阶梯板。%Based on the analysis of various PCB manufacturing technology including HDI PCB for telecommunication system, mix-press cavity PCB, control depth milling and Laser Drill. It designed a new production process ,which integrates plating ladder cavity into HDI PCB, and thus developed a kind of plating ladder HDI PCB which can carry a variety of functional modules for telecommunication system.