摘要：在刚挠结合板制作领域中,挠性板线路图形常用热固性聚酰亚胺覆盖膜来进行保护,但覆盖膜表面光滑,与半固化片结合力差,易导致层间分离,产品可靠性下降,为此业界通常采用局部开窗的方法来进行处理.对于复杂的多拼版结构,覆盖膜开窗后,由整张变成独立的小片,且数量众多,采用目前的手工对位方法,效率低下,无法满足批量生产要求.本文即对此类复杂的覆盖膜开窗贴合工艺进行优化,采用先整板预贴再切割激光对位的工艺,对位精度和生产效率有效提升,利于批量生产和品质管控.%Thermosetting PI coverlay is commonly used in Rigid-Flex PCB manufacturing process for protecting the flexible graphics area, but so smooth is the coverlay surface that it has poor adhesion strength to prepreg , which can easily lead to delamination and decline of production reliability. It is generally to use partial window technology to solve this problem, in this way, the multiple panel is divided into large numbers of single parts after window-cutting. At present the most common alignment method is manual alignment, though ineffective and unable to meet the condition for mass production. Therefore, this paper introduces a method to optimize the window cutting and lamination technology of such complex coverlay, through laminating the full panel first and then window by laser cutting, which effectively improves alignment accuracy and production efficiency and be good for production and quality control.
