添加镍的Sn-Cu系无铅焊料（1）

摘要

This paper describes Sn-Cu series lead-free solders by Ni addition and inhibition of cracking in Cu6Sn5 intermetallic compound formed at cu-sn lead-free solders and Cu interfaces.%概述了添加Ni的Sn-Cu系无铅焊料和Sn-Cu无铅焊料与基板的接合界面上形成的Cu6Sn5金属间化合物中龟裂的抑制。