印制电路板内埋薄膜电阻和聚合厚膜电阻的可靠性初步评估

摘要

Embedding passive components into multilayer printed wiring boards (PWBs) meet the electronic device requirements concerning the necessity of saving the surface board area for active elements, reducing board’s size, improving device functionality and safety as well as overall product cost reduction. Since embedded components cannot be replaced after the board is completed, a long term stability and reliability are the important concerns for manufactures. This paper presents the results of examinations of embedded thin-film NiP resistors and polymer thick-film resistors during their continuous operation and the influence of temperature on the resistance values after the simulation of a lead-free soldering process and after the temperature cycling test (-40℃/+85℃).%　　多层印制板内埋无源元件，可以节省有源元件安装面积，减小印制板尺寸，提高设备功能、提升安全性，并降低制造成本。由于制作完成后内埋式无源元件不可替换，元件是否拥有长期稳定性和可靠性是制造商最关心的方面。文章给出了内埋NiP薄膜电阻和聚合厚膜电阻持续作业的可靠性测试结果，讨论了无铅焊接模拟和温度循环测试（-40℃~+85℃）的温度对阻值的影响。