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Method of applying a polymer thick-film resistive paste for making polymer thick-film resistor having improved tolerances

机译:涂覆聚合物厚膜电阻浆料以制备具有改进的公差的聚合物厚膜电阻器的方法

摘要

The present invention teaches formulations, apparatus and a method of applying high thixotropic index polymer thick-film resistive pastes for making polymer thick-film resistors with improved tolerances by providing a squeegee with a blade tilted at an angle of 10° to 85° to the surface of the printed circuit board thus causing a fluid rotational motion within the bead of the polymer thick-film resistive paste as the squeegee blade moves relative to the printed circuit board. This rotational motion increases the shear strain rate experienced by the paste within the bead and results in a more effective filling of the resistor-shaped cavity without including air bubbles, experiencing elastic recovery of the paste and, without surface fractures of the paste.
机译:本发明教导了施加高触变指数聚合物厚膜电阻糊剂的配方,设备和方法,该方法是通过提供一种刮板,使刮刀相对于橡胶板倾斜10°至85°的角度来制造具有改进的公差的聚合物厚膜电阻器。因此,当吸水扒胶条相对于印刷电路板移动时,会在聚合物厚膜电阻浆料的微珠内引起流体旋转运动。这种旋转运动增加了焊膏在焊珠内经受的剪切应变率,并导致更有效地填充电阻器形腔体,而没有气泡,从而实现了焊膏的弹性恢复并且焊膏没有表面破裂。

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