电镀通孔开路问题的分析和改善

摘要

文章对电镀通孔开路问题进行了分析，主要讲述问题形成的要素和原因，并提出相对应的改善措施。%The report is making analysis on plated through via hole open issue. It mainly describes the concerned factors and reasons of the problem. It provides corresponding corrective actions.