HDI板高厚径比微盲孔跨层微导通孔技术开发

摘要

高厚径比微盲孔的HDI板制作通常需要很好的孔金属化能力保障其导通可靠性，但所需生产设备及其配套成本让不少厂商望而却步。本文所述高厚径比微盲孔跨层微导通孔（skip-μvia）技术，通过定位精度控制、激光钻孔参数调整以及制板流程优化等工艺的开发，能以更低的成本、更高的品质、更短的加工流程以及常规孔金属化设备实现高厚径比的微盲孔制造，从而降低了高厚径比微盲孔HDI板制造的难度。%The micro-blind hole production with high aspect ratio usually requires a strong capability of hole metallization to ensure its connected reliability, but the cost of the necessary equipment and supporting was very expensive for many manufacturers. Herein the techniques of skip-μvia with high aspect ratio micro-blind hold, we can achieve the manufacturing of high aspect ratio micro-blind hole with lower cost, higher quality, shorter machining processes and conventional hole metallization equipment ,through techniques research of positioning precision control,laser-drill parameter adjustment and manufacturing process optimization.Then the manufacturing dififculty of HDI board with high aspect ratio micro-blind hold can be reduced.