首页> 外国专利> MICRO THROUGH-HOLE FORMING DEVICE, METHOD OF MANUFACTURING MICRO THROUGH-HOLE FORMED PRODUCT, AND MICRO THROUGH-HOLE FORMED PRODUCT

MICRO THROUGH-HOLE FORMING DEVICE, METHOD OF MANUFACTURING MICRO THROUGH-HOLE FORMED PRODUCT, AND MICRO THROUGH-HOLE FORMED PRODUCT

机译:微通孔成型装置,微通孔成型产品的制造方法以及微通孔成型产品

摘要

PROBLEM TO BE SOLVED: To provide a micro through-hole forming device capable of forming a large number of micro through-holes in a synthetic resin sheet, a method of manufacturing a micro through-hole formed product, and a micro through-hole formed product manufactured using the method.;SOLUTION: This micro through-hole forming device 10 includes a supporting base 11 and a back sheet 12 which is held on the supporting base 11, has a heat resistance, and supports a synthetic resin base sheet 20. An ultrasonic form block 30 having a large number of projections 31 on the lower part is arranged above the back sheet 12. Since the ultrasonic form block 30 is movable in the vertical direction, it ultrasonically vibrates in the vertical direction to vibrate and heat the base sheet 20. Consequently, the micro through-hole formed product 40 manufactured by forming a large number of micro through-holes 41 in the base sheet 20 is manufactured by melting the base sheet 20.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种能够在合成树脂片材上形成大量的微通孔的微通孔形成装置,制造该微通孔的产品的方法以及形成的微通孔。解决方案:该微通孔形成装置10包括支撑基底11和背片12,该背片12保持在支撑基底11上,并具有耐热性,并支撑合成树脂基底片20。在下部片12的上方配置有在下部具有多个突起31的超声波模板30。超声波模板30在上下方向上可移动,因此,在上下方向上进行超声波振动,从而对基座进行振动和加热。因此,通过在基片20上形成大量的微通孔41而制造的微通孔成型品40通过使基片20熔融而制造。版权所有:(C)2010,JPO&IN坑

著录项

  • 公开/公告号JP2010137313A

    专利类型

  • 公开/公告日2010-06-24

    原文格式PDF

  • 申请/专利权人 DAINIPPON PRINTING CO LTD;

    申请/专利号JP20080314523

  • 发明设计人 YAMADA KANEO;

    申请日2008-12-10

  • 分类号B26F1/26;B29C67/20;

  • 国家 JP

  • 入库时间 2022-08-21 19:05:08

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