印制板导通孔阻焊处理方法研究

摘要

通过对印制电路板导通孔的阻焊处理方法的对比研究；找出不同处理方法的优点和不足。结合生产过程实践和客户要求，过孔阻焊处理方式的选用顺序如：半开窗、全开窗、开窗+阻焊塞孔；建议不采用盖孔处理方法。%Resist clearance on via hole is important for quality of PCB. This paper studied on all kinds of resist clearance and found that the advantage and insufficiency is different. Based on productive process and requirement of customer, the used order is: half opening, all opening, opening with plug hole. Resist coverage on via hole is not recommend.