PCB焊接盘表面涂（镀）覆层简要概括

摘要

The paper summarize that the 4-delopmental process in PCB ifnishing .It describes the merits and demerits of Cu soldered tray. The Cu and metal formational IMC,Inter-metallic compound, effect on the reliability of application, and the necessary condition are affecting the use of the resistive layer in HDI and hi-reliability. The ENEPIG and chemical Ni-Pd alloy are leading development direction.%文章概括了PCB焊接盘表面涂（镀）覆层发展的四个进程。它评述了铜焊接盘的优缺点。铜与金属会形成金属间互化物会影响可靠性和寿命，采用隔离（阻挡）层是高密度互连和高可靠性的必要条件。化学镀镍/钯/金、化学镀镍-钯合金是今后主导的发展方向。