机译:化学镀镍沉金工艺在PCB最终表面上产生表面缺陷的原因
Analytical Research Group Corporate RampampD Institute Samsung Electro-mechanics Co. Ltd. 314 Maetan-3-dong Yeoung-tong-ku Suwon Kyungki-do 443-743 South Korea;
Analytical Research Group Corporate RampampD Institute Samsung Electro-mechanics Co. Ltd. 314 Maetan-3-dong Yeoung-tong-ku Suwon Kyungki-do 443-743 South Korea;
Analytical Research Group Corporate RampampD Institute Samsung Electro-mechanics Co. Ltd. 314 Maetan-3-dong Yeoung-tong-ku Suwon Kyungki-do 443-743 South Korea;
Analytical Research Group Corporate RampampD Institute Samsung Electro-mechanics Co. Ltd. 314 Maetan-3-dong Yeoung-tong-ku Suwon Kyungki-do 443-743 South Korea;
Analytical Research Group Corporate RampampD Institute Samsung Electro-mechanics Co. Ltd. 314 Maetan-3-dong Yeoung-tong-ku Suwon Kyungki-do 443-743 South Korea;
Analytical Research Group Corporate RampampD Institute Samsung Electro-mechanics Co. Ltd. 314 Maetan-3-dong Yeoung-tong-ku Suwon Kyungki-do 443-743 South Korea;
Analytical Research Group Corporate RampampD Institute Samsung Electro-mechanics Co. Ltd. 314 Maetan-3-dong Yeoung-tong-ku Suwon Kyungki-do 443-743 South Korea;
BGA Manufacturing Technology Group BGA Division Samsung Electro-mechanics Co. Ltd. 314 Maetan-3-dong Yeoung-tong-ku Suwon Kyungki-do 443-743 South Korea;
Surface defects; black pad defects; electroless nickel immersion gold; final finishes; PCB; joint failures; hypercorrosion defects;
机译:化学镀镍沉金工艺在PCB最终表面处理中产生表面缺陷的原因
机译:开发用于PCB最终表面的化学镀镍沉金工艺
机译:温湿处理对化学镀镍金(ENIG)和化学镀镍钯金(ENEPIG)表面处理的环氧树脂Sn-58Bi焊料弯曲可靠性的影响
机译:使用化学镍/沉金作为最终表面处理PCB中“黑垫”缺陷的机理的研究
机译:镍金和浸银印刷电路板上的镍增强锡铜焊点的微观组织演变。
机译:薄电解质层下覆铜箔层压板和化学镀镍/浸金印刷电路板的电化学迁移行为
机译:无铅焊料与化学镍/浸金(ENIG)表面涂层之间的界面反应