The quality of barrel cyanide copper plating was affected by higher zinc impurity in the electrolyte , which could be eliminated by potassium sulfide precipitation method. With addition of 1 Ml/L ammonia spirit, the zinc deposition rate could be increased and the zinc impurity could be reduced to a lower level. The concentration of sodium carbonate could be controlled lower than 75 g/L by increasing sodium hydroxide concentration to 5.0 ~ 7. 5 g/L. An increase in the ratio of copper to free sodium cyanide enhances the copper deposition rate at the lower current density region, which favorites the quick diminish of pores in the surface. Under lower speed of barrel, the plating time could be reduced to a certain extent.%锌合金压铸件氰化滚镀铜镀液中的锌杂质过高影响镀层的质量,研究了用硫化钾沉淀锌去除锌杂质.在日常生产中向镀槽中加1 mL/L氨水,能够加快锌在阴极上的沉积速度,将锌杂质控制在较低的浓度.将氢氧化钠提高到5.0～7.5 g/L,碳酸钠被控制在75 g/L以下.提高镀液中铜离子和游离氰化钠的比值,可加快铜在镀件低电流密度区的沉积速度,有利于较快地封盖镀件表面的孔隙.在锌合金压铸件氰化镀铜过程中,采用较低的滚桶转速可在一定程度上缩短电镀时间.
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