复合毛细芯热柱传热极限的建模方法及实验研究

摘要

Aiming at existing problem of heat dissipation on high heat flow density electronic chip,a kind of composite wick heat column was put forward.Composite wick was formed through copper fiber sintering on orthogonal micro grooves,micro groove was processed by ploughing-extrusion and copper fiber was processed by multi tooth tool.Through analyzing and deriving of composite wick heat column structure and a variety of factors of heat transfer limit,the entrainment limit,capillary limit and boiling limit of composite wick heat column were established.It provides important theoretical basis for heat column study,and the experiment authenticates that the built theory model of composite wick heat column is correct.%针对高热流密度电子芯片散热存在的问题,提出了一种复合毛细芯热柱.复合毛细芯由正交微沟槽上烧结铜纤维得到,微沟槽采取犁切挤压的方法加工,铜纤维采用多齿刀具加工.通过对复合毛细芯热柱的结构和传热极限的各种因素进行分析推导,建立了复合毛细芯热柱的携带极限、毛细极限以及沸腾极限,为热柱的研究提供了重要的理论基础；实验验证了所建立的复合毛细芯热柱的理论模型的正确性.