固晶臂是全自动LED芯片键合机的核心零部件之一,是芯片取放的最终执行机构,其结构特性跟芯片键合的效果直接相关. 针对类似悬臂梁的固晶臂结构进行了分析与研究,利用相关软件对其进行了静力学分析与模态分析,最终给出了合理的固晶臂结构的数字模型.%Bond head is one of the key parts of automatic LED die bonder , and the last actuator to guarantee the quality of LED .This article analyses the structure of the bond head based on the mechanical&modal analysis of the cantilever structure , and shows a suitable digital structure of bond head .
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