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Wafer-to-Wafer and Die-to-Wafer Bonding of Phase-Change Material (PCM) Switches with Integrated Circuits and Bonded Two-Die Devices
Wafer-to-Wafer and Die-to-Wafer Bonding of Phase-Change Material (PCM) Switches with Integrated Circuits and Bonded Two-Die Devices
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机译:具有集成电路和键合双芯片器件的相变材料(PCM)开关的晶圆对晶圆和芯片对晶圆键合
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摘要
In a method for wafer-to-wafer bonding, an integrated circuit (IC) wafer and a phase-change material (PCM) switch wafer are provided. The IC includes at least one active device, and has an IC substrate side and a metallization side. The PCM switch wafer has a heat spreading side and a radio frequency (RF) terminal side. A heat spreader is formed in the PCM switch wafer. In one approach, the heat spreading side of the PCM switch wafer is bonded to the metallization side of the IC wafer, then a heating element is formed between the heat spreader and a PCM in the PCM switch wafer. In another approach, a heating element is formed between the heat spreader and a PCM in the PCM switch wafer, then the RF terminal side of the PCM switch wafer is bonded to the metallization side of the IC wafer.
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