随着金属基复合材料工业化的应用越来越广，金属基复合材料的连接越来越受到人们的重视。尤其对于电子封装材料而言，增强体分率一般较高，而且要求其密封性和致密性，同时还要求具有良好的连接性能。针对此种情况，根据半固态工艺“固液冶良好的扩散性和充填性，提出了金属基复合材料半固态模锻成形与连接一次性整体成形工艺方法，并实现近净成形，为金属基复合材料制件的制备和连接提供了一条新途径。%As the industrial application of metal matrix composites is more and wider, about the connection of metal matrix composites has attracted more and more attention, especially for electronic packaging materials, fraction of reinforce-ment is normally higher, and requires its sealing and compactness. At the same time it also requires a good connection per-formance. For these reasons, according to the semi-solid process being with good diffusivity and filling during "solid liq-uid" state, the authors put forward the metal matrix composites die forging forming in semisolid state technology. The form-ing process and connecting procedures are finished at one-time and realizes near net shaping. It provides a new way for the preparation of metal matrix composites and connection.
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