DSC及IR联合测定环氧树脂-双氰胺体系固化工艺参数

摘要

The effect of the amount of dicyandiamide on the curing reaction of epoxy resin has been investigated , using non-isothermal DSC method and the reaction kinetics of the epoxy resin -dicyandiamide system has been studied, using DSC curves measured at different heating rates. Simultaneously, the optimum curing condition has been established , using DSC and IR analytical technique. The experimental results indicate that the optimum amount of dicyandiamide is 5. 6%, curing temperature 403K and curing time 70 min. The activation energy and reaction rate for the curing reaction of the epoxy resin-dicyandiamide system were calculated to be 96. 82 Kj/mol and 0. 93, respectively.%采用非等温DSC法研究了固化剂用量对环氧树脂固化反应的影响,同时利用不同升温速率下测得的DSC曲线研究了环氧树脂-双氰胺体系的固化反应动力学,并由DSC及IR分析技术确定了该体系的最佳反应条件.实验结果表明:固化剂双氰胺最佳用量为5.6％,最佳固化温度为403 K,固化时间为70 min,该体系的反应活化能为96.82 kJ/mol,反应级数为0.93.