Curing behavior of dicyandiamide/epoxy resin system using different accelerators

摘要

Various amounts of dicyandiamide (Dicy), two grades of epoxy resins, i.e. Epiran 06 and Epikote 828, and three different accelerators including benzyl dimethyl amine (BDMA), 3-(4-chlorophenyl)-l,l-dimethyl urea (Monuron) and 2-methyl imidazole (Im) were used in curing of Dicy/epoxy resin system. Both of the used epoxy resins were based on diglycidyl ether of bisphenol A (DGEBA). The effects of type and concentration of accelerators on curing behavior were studied by differential scanning calorimetry (DSC) method in dynamic or non-isothermal mode. The optimum concentration of Dicy for curing of epoxy resins was obtained based on the glass transition temperature of the cured epoxy/Dicy formulations. The maximum glass transition temperature of 139℃ was obtained at the stoichiometric ratio of Dicy to epoxy of 0.65. The results showed that BDMA has a broader curing peak in DSC and starts the cure reaction earlier than the others. However, Monuron has a narrow curing reaction peak with good cure latency. The tensile properties of Dicy-cured Epiran 06 and Epikote 828 epoxy resins reinforced with chopped strand mat showed that these two epoxy resins have similar mechanical properties. For composites based on the Epiran 06 and Epikote 828 reinforced with 40 wt % glass chopped strand mat, tensile strength and modulus were 156 and 153.4 MPa and 11.6 and 12.4 GPa, respectively.