首页> 中文期刊> 《中南大学学报(自然科学版)》 >膜法处理印制线路板PCB酸性含铜电镀废水

膜法处理印制线路板PCB酸性含铜电镀废水

         

摘要

采用纳滤膜和反渗透膜组合处理含铜酸性电镀废水,通过试验考察操作压力、流量、温度等对渗透通量和截留率的影响.研究结果表明:在合适的操作条件下,纳滤膜对Cu2+的截留率在96%以上;反渗透膜对Cu2+的截留率在98%以上.纳滤膜较佳操作条件为:温度26℃,操作压力1.5 MPa,流量16 L/min.反渗透膜较佳操作条件为:温度36℃,操作压力2.0 MPa,流量14 L/min.%The nanofiltration (NF) membrane and reverse osmosis membrane (RO) were used to treat the copper-containing acid electroplating waste water produced by printed circuit board (PCB), and the effects of trans-membrane pressure (TMP), flow velocity and temperature on the permeate flux and Cu2+ rejection were studied. The result shows that under optimal condition, Cu2+ retention of NF is over 96% and that of RO is over 98%. The optimum operating conditions for NF membrane are as follows: temperature 26 ?, TMP 1.5 MPa, flow velocity 16 L/min, and for RO membrane: temperature 36 ?, TMP 2.0 MPa, and flow velocity 14 L/min.

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