Plating method using an acid copper plating bath and the plating bath containing an acid copper plating bath additives and the additive

摘要

PROBLEM TO BE SOLVED: To provide an additive for an acid copper plating bath with which the formation of pits in a plating film is suppressed, and aid copper plating can be carried out with high reliability, to provide an acid copper plating bath comprising the additive, and to provide a plating method using the plating bath.;SOLUTION: The additive for an acid copper plating bath comprises an anthraquinone based compound expressed by formula (1) [in the formula, each of R¹, R² and R³ is the same or different, and denote a hydrogen atom, a hydroxyl group, a sulfone group or an amino group; R⁴ and R⁵ each is a hydrogen atom, an amino group or a group-NHR' (R' is a phenyl group which may be substituted, a phenyl alkyl group which may be substituted, a phenyl amino group which may be substituted or an anthraquinonyl group which may be substituted); R⁶ denotes a hydrogen atom, a hydroxyl group, a 1 to 20C alkyl group or a sulfone group, respectively; and A denotes an oxygen atom or forms a group (CH-CO-NCH₃-)together with R⁴] or the salt thereof. The acid copper plating bath comprises the additive. The plating method uses the plating bath.;COPYRIGHT: (C)2004,JPO