ADDITIVE FOR ACIDIC COPPER PLATING BATH, ACIDIC COPPER PLATING BATH CONTAINING THE ADDITIVE AND PLATING METHOD USING THE PLATING BATH

摘要

PROBLEM TO BE SOLVED: To provide an additive for an acidic copper plating bath with which copper plating can be applied to a substrate having fine holes such as through holes and via holes and to a resin film having a surface coated with metal such as copper, to provide an acidic copper plating bath containing the additive, and to provide a plating method using the plating bath.;SOLUTION: The additive for an acidic copper plating bath contains the following components of (a) to (c): (a) a polymer of an alkylamine and a glycol by 0.01 to 2 g/L; (b) polymer components by 0.01 to 10 g/L; and (c) carrier components by 0.02 to 200 mg/L. The acidic copper plating bath contains the same additive. The plating method uses the same plating bath.;COPYRIGHT: (C)2004,JPO