LEVELLING AGENT FOR PLATING, ADDITIVE COMPOSITION FOR ACIDIC COPPER PLATING BATH, ACIDIC COPPER PLATING BATH, AND PLATING METHOD USING THE PLATING BATH

摘要

PROBLEM TO BE SOLVED: To provide a novel levelling agent for plating which gives excellent characteristics in any of plating appearance such as plating covering power for the insides or corner parts of blind via holes or through-holes and levelling property of a plated surface and is capable of coping with substrate defects.;SOLUTION: The levelling agent for plating comprises a copolymer of diallyl dialkyl ammonium alkyl sulfate, (metha) acryl amide and sulfur dioxide which contains a diallyl dialkyl ammonium alkyl sulfate unit, a (metha) acryl amide unit and a sulfur dioxide unit.;COPYRIGHT: (C)2008,JPO&INPIT