Acid copper sulfate plating bath: Control of chloride and copper. Final report.

摘要

Plated-through holes in high-reliability printed wiring boards require a ductile copper plate of uniform consistency. The level of control of the chemical constituents in the electroplating solutions dictates the physical properties of the copper plate. To improve the control of the chemical bath constituents, in-situ methods for electrochemically determining copper and chloride in acid copper sulfate baths were developed. A solid-state ion-selective electrode was used for the chloride ion and proved to be more reproducible than conventional silver chloride turbidimetric methods. The use of a copper solid-state ion-selective electrode in-situ was also successful in this application.