首页> 中文期刊> 《仪表技术与传感器》 >硅片总厚度偏差及翘曲度检测装置研制与测试

硅片总厚度偏差及翘曲度检测装置研制与测试

     

摘要

通过机械结构、控制系统及显示系统设计,研制了硅片总厚度偏差及翘曲度检测装置,该装置具备自动送料、自动检测、自动回料、自动显示与数据存储等功能;设计相关实验条件,对装置进行了测试,并根据测试结果分析了其测量不确定度;将装置与Mahr测长仪进行了比较测量,试验表明,该装置精度满足设计要求,且性能稳定.%Through the design of mechanical structure,control system and display system,the total thickness deviation and warpage detection device was developed.The device has the functions of automatic feeding,automatic detection,automatic feeding, automatic display and data storage.With the design of relevant experimental conditions,the device was tested,and the measure-ment uncertainty was analyzed according to the test results.The device was compared with the Mahr length measuring instrument, and the experimental results show that the accuracy of the device meets the design requirements and the performance is stable.

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