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PCB工艺中金相分析磨抛液的研究

     

摘要

在PCB工艺流程中金相切片检测抛光所使用的抛光液大多以金刚砂为主要抛光填料,该文采用的是更廉价的氧化铝抛光粉作为抛光组分。对氧化铝抛光粉进行12h的球磨处理,配置成了组分为3%氧化铝抛光粉,0.1%活性炭粉,0.5%没食子酸,约96%乙醇的抛光液。该抛光液的稳定性和抛光效果均达到应用要求,并大幅降低了成本。%Emery is mostly used as the main component in slurry of the detection of metallographic sections polishing in currently process of PCB. In this study, we use alumina powder as the main polishing component to reduce costs. We deal alumina powder with ball-milling for 12 hours. Then the slurry is made up of 3 % of alumina powder, 0. 1% of activated carbon powder, 0. 5 % of gallic acid and about 96% of ethanol. It can meet the requirements of stability and polishing with decreasing cost.

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