SMT-PGA封装焊点热疲劳寿命预计模型研究

摘要

Objective To study the thermal fatigue life prediction model of solder joints for SMT-PGA package.Methods The thermal fatigue life of SMT-BGA package solder joints was predicted based on the Engelmaier model;and then it was compared with simulation results of CALCE PWA life assessment software of University of Maryland.Results The calculated results were quite different from the simulation results of CALCE PWA software.Conclusion Engineering factor F in the Engelmaier model is not a fixed constant but affected by the minimum steady state temperature of package.%目的 研究SMT-PGA封装焊点热疲劳寿命预计模型.方法 运用Engelmaier模型预测SMT-PGA封装焊点的热疲劳寿命,并将Engelmaier模型计算结果与美国马里兰大学CALCE PWA寿命评估软件仿真结果作对比.结果 模型计算结果与马里兰大学寿命评估软件仿真结果存在较大差异.结论 表明Engelmaier模型中的工程因子F并不是一个固定常数,而是受封装最低稳态温度的影响.