运用单纯形优化法对铜箔棕化处理的配方和工艺条件进行动态寻优,得到最优组合为:内层键合剂25～40 mL/L,浓硫酸55～60 mL/L,双氧水35～ 50 mL/L,温度30～45℃,时间50～60 s.在最优条件下棕化处理的铜箔与树脂的剥离强度达0.74 kg/cm,经100个冷热冲击循环、6次高温浸锡和6次无铅回流焊后均无分层、爆板现象.棕化后的铜箔表面形成了微观均匀的蜂窝状孔隙结构,剥离时分层发生于有机铜氧化膜与铜基板的界面处.%The bath composition and process conditions of brown oxidation for copper foil were dynamically optimized by simplex optimization method as follows:inner bonding agent 25-40 mL/L,concentrated sulfuric acid 55-60 mL/L,hydrogen peroxide 35-50 mL/L,temperature 30-45 ℃,and time 40-60 s.The peeling strength of copper foil treated by brown oxidization under the optimal conditions to pre-preg is up to 0.74 kg/cm.There is no stratification and delamination on the brown oxidized copper foil after thermal shock cycling for 100 times,tin immersion at high temperature for 6 times,and lead-free reflow soldering for 6 times.The surface of brown oxidized copper foil features a microscopically uniform honeycombed and porous structure,and the stratification occurs at the interface between organic copper oxidation film and copper substrate when the brown oxidation film is peeled.
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