电子封装中电镀技术的标准化现状

摘要

The work of standardization in the field of electroplating technologies for electronic packaging done by the Semiconductor Equipment and Materials International (SEMI) and other international standardization organizations was introduced.The current status of domestic standardization in this field was analyzed.Some key points of domestic standardization organization in this field were presented.%介绍了SEMI(国际半导体设备与材料协会)等国际标准化组织在电子封装领域内电镀技术的标准化工作情况.分析了该领域国内的标准化现状,并提出了国内标准化组织的工作重点.