微波组件的关键组装工艺技术

摘要

介绍了微波组件组装过程中的关键工艺技术，包括大面积接地互连技术、芯片贴装技术、引线键合互连技术以及密封技术，对每种工艺技术又分别介绍了几种常用实现方法，并阐述了每种工艺方法的机理以及各自的优缺点，以及影响组装质量的主要因素和优化方法。%The key multi-assembly processes of microwave module mount technology are discussed, which include large area grounding interconnection technology, chip bonding technology, interconnection of wire bonding technology and sealing technology. Some usual methods of each process are introduced separately, especially their elements as well as advantages and disadvantages, moreover, probe into their factors affecting on quality and optimization methods.