电子封装用低膨胀高导热SiCp／A1复合材料研究进展

摘要

With the rapid development of microelectronic and semiconductor technology, the density of electronic packaging increases quickly, which results in the higher request to the materials. SiCp/Al composites received extensive attention because of its superior properties such as low thermal expansion, high thermal conductivity and low density. As electronic packaging materials, SiCpAl composite materials have gained actual applications in aerospace, optics and instruments. This paper introduced the research and development of aluminum reinforced with silicon carbide particles composites and discussed several manufacturing methods, such as powder metallurgy method, spray deposition method, stir casting method, pressureless infiltration method and pressure casting method. In addition, merits and defects of variety of fabrication used were analyzed and the directions for the future research and development of the technology were prospected.%随着微电子技术及半导体技术的快速发展，高封装密度对材料提出了更高的要求。SiCP／Al复合材料具有低膨胀系数、高导热率、低密度等优异的综合性能，受到了广泛的关注。作为电子封装材料，SiCP／Al复合材料已经在航空航天、光学、仪表等现代技术领域取得了实际的应用。文章介绍了SiC颗粒增强铝基复合材料的研究现状，详细阐述并比较了几种常用的制备方法，包括粉末冶金法、喷射沉积法、搅拌铸造法、无压渗透法、压力铸造法等，进一步分析了各种方法的优缺点，并在此基础上展望了未来研究和发展的方向。