首页> 中文期刊> 《电子元件与材料》 >基于LTCC技术的Ku波段金丝线匹配的研究

基于LTCC技术的Ku波段金丝线匹配的研究

         

摘要

基于低温共烧陶瓷(LTCC)技术,设计了Ku波段金丝键合线宽带匹配电路,该电路应用多节1/4波长传输线对两根金丝键合线在Ku波段进行了具有二项式响应的宽带匹配.三维电磁场仿真表明,匹配后在Ku波段的回波损耗达到-20 dB.以下,有效提高了信号的通过率.该匹配电路在LTCC基板上所占面积小、实现较为简单.%Based on the low temperature co-fired ceramics (LTCC) technology, the broadband match circuit of gold bonding wire in Ku-band was designed. This circuit used the multi-section of quarter-wave transmission lines, which has broadband match of binomial response on two gold bonding wires in Ku-band. The results of 3D electromagnetic field simulations show that the return loss after the match circuit is lower than -20 dB in Ku-band, and the signal pass ratio is increased effectively. The area of the match circuit is small on the LTCC substrate, and whose application is relative simple.

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