MID工艺制程塑模电子互联部件电镀

摘要

MacDermid MID Copper and supporting processes specifically designed for molded interconnect device applications. Designed to deliver 麦德美MID沉铜及后续的沉镍、沉金化学镀产品广泛应用于手机外壳、电子线路的金属化中。