基于紧支集双正交小波的芯片焊点定位技术研究

摘要

The chip packaging is the important technology to protect and enhance chip electric performance.After the chip is pasted on the lead frame,its function is realized by connecting the chip solder joint with the lead frame of a metal lead.In order to improve the accuracy of IC wire bonding and to ensure bonding machine can realize accurate positioning,the compactly supported bi-orthogonal wavelet multi-resolution analysis method was used for rapid detection and feature matching based on the edge of the chip and the substrate patch.This method can realize the accurate extraction,recognition and feature matching of the edge feature of the chip image.The algorithm can simplify the complexity of the algorithm and improve the detection efficiency and accuracy of the solder joint position.%芯片封装是保护芯片和增强芯片电热性能的重要工艺,在芯片粘贴在引线框架的贴片基板上后,用金属引线将芯片焊点与引线框架的管脚连接起来实现芯片功能.为了提高芯片引线键合的精度,确保键合机的焊头能够实现准确定位,采用基于紧支集双正交小波的多分辨率分析方法实现芯片和贴片基板边缘的快速检测和特征匹配,实现芯片和引线框架焊点的快速定位.这种方法能够实现芯片图像边缘特征的准确提取、识别和特征匹配.采用紧支集双正交小波进行芯片焊点和引线框架定位时,简化了算法的复杂度,提高了芯片引线框架焊点位置的检测效率和定位精度.