A wind sensor,with power adjustment for non-ideal packaging compensation,is reported. In the structure of the sensor,two Platinum/Titanium resistors surround together in the center of the chip. They are used to hot the sensor to make its temperature be higher than the ambient to a constant value and detect the average temperature of the sensor. The heat distribution is detected by four Platinum/Titanium resistors,located symmetrically on the chip.The thermal asymmetric distribution in the sensor,due to non-ideal packaging was sampled by a Micro Control Unit (MCU). An expression of the thermal asymmetry was obtained to provide feedback signals to adjust the heating power of four auxiliary heaters and cancel the affect of thermal asymmetry. After compensation by power distribution adjustment,the output signal fluctuation is reduced to 10mV,and the error of wind direction testing is less than 2°.%提出一种基于陶瓷衬底制备的风速风向传感器的设计,芯片结构中设置了1个中心加热电阻,1个中心测温电阻和4个温度分布检测电阻,并引入了4个辅助加热电阻,用于对芯片的功率分布进行再分配.在传感器制备过程中,对于封装造成的芯片表面热分布的不对称特性,能够利用辅助加热元件对芯片进行功率再分布以补偿,进而抵消掉由于热不对称造成的芯片输出信号的偏移.通过功率再分布补偿技术,可使芯片输出信号的波动低于10mV,风向检测误差低于2°.
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