红外探测器封装陶瓷衬底材料特性及其应用研究

摘要

随着红外探测器阵列规模快速提升,在封装杜瓦要求轻量化、低成本、高效率的形势下,封装杜瓦陶瓷衬底设计难度加大.文章对比了几种科研实际中使用的陶瓷材料特性及其工艺可行性;研究了在测试杜瓦中,随着混成芯片阵列规模的提升,热应力与芯片尺寸的相对关系;研究了Al2 O3、AlN、SiC衬底材料在降低芯片热应力方面的能力差异;结合目前陶瓷加工工艺水平、加工成本以及探测器阵列规模,给出了Al2 O3、AlN、SiC衬底材料在实际应用中的选取建议.%With the rapid increase of infrared detector array scale,the package dewar has the requirement of light weight,low cost,high efficiency,so the design of ceramic substrates is more difficult.The properties and technological feasibilities of several ceramic materials were compared.The relationship between thermal stresses and chip sizes was studied .The differences of Al2 O3 ,AlN,SiC substrates were studied in reducing the thermal stresses of the chips.The application conditions of Al2 O3 ,AlN and SiC substrate materials in practical application is given based on the present ceramic processing technologies,cost and detector array scale.