As a new type of phenolic resin, polybenzoxazine has not only the advantages of traditional phenolic resins such as high thermal properties and low water absorption, but also other properties not found in conventional phenolic resins such as molecular design flexibility, no by-products release du-ring the curing process, high dimensional stability and excellent flame-retardancy.In recent years, the processing of benzoxazine resins have received increasing attention from microelectronic, printed circuit board or encapsulation, and aerospace industries.Typical drawbacks of polybenzoxazines are the high temperatures required for curing and the brittleness of the cured material.In this review, various me-thods for enhancing the performance of polybenzoxazines are described, including the molecular design of monomers, introduce cross-linkable units, high relative molecular weight polymer precursors, polymer alloys and nanocomposite.Recently, polybenzoxazine nanocomposites constructed with graphene composite and POSS rise have become the potential candidates for electronic applications due to their excellent thermal and dielectric properties.%聚苯并噁嗪通过环状苯并噁嗪单体热诱导开环聚合得到, 作为一种新型的酚醛树脂,不仅具有传统酚醛树脂的耐热、低吸水性等性质, 还具有传统酚醛树脂不具备的性能, 如分子设计的灵活性、固化反应没有小分子副产物产生、优异的尺寸稳定性以及良好的阻燃性能, 在微电子、印刷电路板、电子封装以及航空航天等高技术领域具有广阔的应用前景.然而, 聚苯并噁嗪缺点是固化温度高、固化材料脆性大.本文介绍了聚苯并噁嗪性能增强的各种方法, 包括新型单体分子设计、引入可交联单元、高相对分子质量聚合物前体制备、聚合物合金化、纳米复合等.最近, 石墨烯和笼型聚倍半硅氧烷(POSS)与聚苯并噁嗪复合材料因具有优异的热性能和电学性能, 成为先进电子材料的潜力材料.
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